Thin metal is small soldering research

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Small technology to numerous more advanced way develops, change like more most advanced and smaller size, sophisticated technology, taller local intelligence, more accurate online dependability is forecasted and lower cost. These development trends will make us use new-style material to reach assemble a technology, drive pulse laser to make manufacturing tool thereby. In addition, suit to yield craft rate at average laser power, ought to use pulse laser technology. Current, the facula diameter that reinforce of a few solder uses need minimum (30-40m) , and low the pulse energy to 10mJ. Nd:Y of low power pulseAG laser can offer needs facula diameter, and laser parameter special also apply to thin metal (40 M-1000 M) small solder. In addition, numerous small solder reinforce uses the power stability that all needs the height below the stability between good arteries and veins and situation of low pulse energy, realize satisfactory craft n thereby. The article will be aimed at 125W pulse Nd:YWhat AG laser provides all sorts of data is small solder data, introduce 100W successive wave fiber-optic laser getatable is relevant result. Laser is tiny solder technical laser is tiny solder technology but two millimeter the component of the following size is mixed through soldering material fusion joins together, basically use at the structure to shape. Laser is tiny solder the technology applies extensively in the different domain such as application of electron, medicine, general industry and car. Because need to change heterogeneous miniature metallic component to join together, this one technology develops a tendency to soldering the method posed grim challenge. Of heterogeneous metal but weldability depends on numerous and different element. Physical property is conducted to energy coupling and heat having distinct effect. Pulse laser solders craft undertakes controlling through a variety of different parameter, include duration of density of average power, peak value power, power, pulse, lateral velocity and pulse weaveform to wait among them. Technology of self-excitation light small join is inchoate since development, pulse Nd:YAG laser is a kind of efficient technology choice all the time. Fiber-optic laser and dish form laser near future serves as potential laser small connection to replace technical emerge in large numbers to come out. The article uses the introduction Nd:Y of pulse lamp pump respectivelyWhat AG and fiber-optic laser circumstance issue all sorts of data is small solder parameter. Nd:Y of pump of lamp of pulse of experimental job ●We use AG laser GSI new-style Nd:YAG pulse laser (model JK125) undertook soldering to a series of material experiment. This kind of laser has quality of top beam of light, can raise craft rate not only, lengthen work space, and return diameter of can contractible facula, ideal is applied to small solder requirement. Laser light beam is in of 15m × 150 M fiber-optic in transmit, fiber-optic with the 200mm that deserves to have focusing optics parts of an apparatus output casing undertakes termination. Output casing deserves to have 200 millimeter focus again calibration camera lens, used all sorts of focusing camera lens in the experiment. Graph the skeleton map of 1 laser light beam that indicated fiber-optic extreme and focal point. Gas of argon gas protection makes coping welding line is soldering can prevent to solder in the process oxidation, gas is transmitted through the conduit of 10mm diameter (rate is minutely 10 litres) . The central point that surges beam of light is in workpiece apparently. Laser of ● fiber-optic laser uses Scanlab Scanner (model is Hurry Scan 10) setting. This scanner deployed camera lens of 160mm focal length, the facula diameter that computation reachs is 34 M about. The focal position during the experiment is in example coping. Argon is used to enrage protective gas during soldering. Through be on fixed workpiece scanning laser light beam forms weld junction. Laser of Chan Moguang fine shoots a gauss beam of light, m2 <1.

10 (see a picture 2) . Experimental result discusses Nd:Y of pump of ● pulse lampLight beam of laser of AG laser pulse solders craft can undertake controlling through all sorts of parameter, include power of density of power of average peak value, average laser among them, solder speed and pulse duration. This research discusses side overweight these to basically handle parameter to soldering the influence of quality. Thin sheet metal is small solder main advantage of the technology depends on: The heat with extremely low A) inputs: Just offer when need only solder electric energy, can achieve superior control performance. B) cleanness solders: Besides the exterior beautiful besides, solder cleanly to still conduce to simplify disinfection works, facilitate with its his equipment cooperates to use. C) is strong solder: Laser beam welding receives a number little, intensity is high. D) close soldering and sealing receives: Differ with stannic solder or cupreous solder, laser beam welding is received can achieve the sealed performance that be too busy, this is crucial to numerous miniature application. The key of this research depends on making clear weak data board soldering laser parameter, later development gives out to have the result of experimental earning to stainless steel material only. The experimental result of other material, pass email please (Naeemm@gsilumonics.

Com) contact him author. ● stainless steel (seam welding) use beam of light of swash of rectangular arteries and veins to solder, initiative aiguille signal is shown 3 times like the graph, material ply is as follows: Seam welding ply is 0.

5mm-2.

0mm, spot welding ply is 20 M-70 M. 0.

5-2.

0mm ply material solders in what diameter of different solder spot falls speed is shown 4 times like the graph. Pass experimental discovery, width of pulse energy, pulse and peak value power are good to ensuring solder quality has very main effect. The bath quantity of pulse depends on pulse energy. Give data and character, realize certain frit to receive permeate deepness to need to have lowermost pulse energy. The influence solders the other element of function includes focal position, focal length and floating rate. Because the depth of field of long focal distance is better, use so longer focal length lens (160mm and 200mm) solder thicker material (like 1.

5mm and 2mm) when, its speed wants a bit fast at lens of short focal distance (80mm and 120mm) . ● stainless steel (spot welding) thin stainless steel board laser spot welding has the following characteristic: Solder bath small, high temperature and cutty craft time. Solder the temperature of bath is extremely high, often exceed the boiling point of alloy. Heating in the process, as the development of pulse, evaporate rate also rise quickly subsequently. When pulse is stopped, because solder the fast refrigeration of bath, evaporate rate is almost immediateness fall to extremely low cost. Through stainless steel chip spot welding experiment confirms, pulse duration and pulse energy are the influence solders the two big main factors of quality. Experimental result still points out, in spot welding application pulse energy maintains constant circumstance to fall, the change of pulse duration can be mixed to welding line dimension quality produces apparent effect, because the change of density of peak value power is caused,this is. Stainless steel board (20-150 M) spot welding applies extensively at driver of electronic industry hard disk to bend solder domain. Disk drive curves package is chip of 300 series stainless steel component, the kind that takes juncture through spot welding joins different chip together, every equipment includes 4 different package. The most generous package is the installing plate with thick 260 M. Through 40 M of two pairs of spot welding general on installing plate thick bedspring solders on, additional two pairs of spot welding solder through bedspring on 70 M bears the weight of thickly crossbeam. Only a pair of spot welding solder through 40 M bends thickly with bear the weight of crossbeam is linked together. The welding line diameter on exterior top component is 120 M-150 M about, welding line all won't permeate motherboard. Disk drive curves the main demand of spot welding to include: Prevent to solder splatter, solder cannot appear dent, and the diametical size with should be achieved certain solders with ensuring intensity. We studied a series of laser and craft parameter (like pulse energy and width, bundle gas of spot volume, protection and focal position) . Study the result makes clear, we should retain average laser power enough low, realize the high grade spot welding that does not have laminose twist thereby. Spot welding passes technology of laser pulse figuration to finish, but actual in already caused the surface to splatter slightly, this cannot be accepted. We should optimize pulse figuration technology further, so that eliminate,solder splatter problem. Undertake with the pulse figuration technology after optimizing spot welding can achieve better result. About soldering experimental summary we use Nd:Y of pulse of low average powerAG laser undertook soldering to numerous material experiment, studied the performance of laser of 100W Chan Moguang fine. ● considers to discover, change through proper pulse time electric energy (pulse figuration) , can include aluminous, copper, alloy to wait tall a variety of different material that reflex material inside realize high quality to solder. ● combines laser parameter and look of pulse figuration technology, can realize extensive heterogeneous data to solder. Use pulse figuration technology, those who be not all material solder the problem all can be solved, but as pulse laser technology rise ceaselessly, of heterogeneous material solder the technology is sure to progress ceaselessly. ● pulse Nd:YAG laser is tiny solder main competitor of the technology is fiber-optic laser and dish form laser. Of laser of 100W Chan Moguang fine solder simply experimental report goes out: The quality of beam of light of A) fiber-optic laser is higher, can use below pulse and successive wave movement to implement bundle of lesser spot measure in the light of small solder reinforce (34 M) . B) depends on the average power of 100W and small facula, can come true adequately amount to 0.

The stainless steel with 5 thick millimeter board solder. Solder function can be rivalled with titanium alloy photograph. When using CW to run, the area photograph that be heated affects runs to pulse and character summary is a few bigger. The material such as C) aluminium alloy, copper and brass cannot solder. Every square centimeter 8.

The power density of 6 × 10W can't solve the reflection problem of these material. The experimental result of CW and pulse technology is similar. CNC Milling CNC Machining